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Western Digital Intros World’s First 512 Gigabit 64-Layer 3D NAND Chip

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Western Digital has today announced that it has commenced pilot production of the company’s 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan. Mass production expected in the second half of 2017. The first of its kind, the chip is the latest achievement in a nearly three-decades-long legacy of flash memory industry firsts from the storage leader.

“The launch of the industry’s first 512Gb 64-layer 3D NAND chip is another important stride forward in the advancement of our 3D NAND technology, doubling the density from when we introduced the world’s first 64-layer architecture in July 2016,” said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. “This is a great addition to our rapidly broadening 3D NAND technology portfolio. It positions us well to continue addressing the increasing demand for storage due to rapid data growth across a wide range of customer retail, mobile and data center applications.”

The 512Gb 64-layer chip was developed jointly with the company’s technology and manufacturing partner Toshiba. Western Digital first introduced initial capacities of the world’s first 64-layer 3D NAND technology in July 2016 and the world’s first 48-layer 3D NAND technology in 2015; product shipments with both technologies continue to retail and OEM customers.

Western Digital will present a technical paper on the advancement in high aspect ratio semiconductor processing that made this technology achievement possible tomorrow, February 7, at the International Solid State Circuits Conference (ISSCC).

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TEAMGROUP Launches ELITE PLUS DDR5 Memory Modules

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TEAMGROUP has launched the ELITE PLUS DDR5 Desktop Memory with a brand new heat sink design to effectively increase reliability. Furthermore, TEAMGROUP has announced a new frequency of 6,000MHz for ELITE DDR5 to further increase operating performance and deliver an ultra-smooth user experience.

ELITE PLUS DDR5 Desktop Memory is equipped with a sleek, simple, and asymmetric aluminium heat sink that has been specially designed to be non-conductive and to protect against scratches, acids, rusting and rotting to provide full protection for the DDR5 module. ELITE PLUS DDR5 Desktop Memory is also equipped with a 1.1V standard working voltage which further reduces energy consumption for each unit of bandwidth compared to the 1.2V in DDR4, providing a more efficient power usage.

The DDR5 module is equipped with PMICs for effective power distribution, reliable power supply, and minimal noise interference. The IC supports on-die ECC, a feature that self-corrects DRAM cells for enhanced stability and reliability by reducing risks of information errors. The ELITE PLUS DDR5 modules are designed to be perfectly compatible with Intel and AMD systems and come with three frequencies: 4800MHz, 5600MHz, and 6000MHz, in single/dual channel options from 8GB to 32GB of storage capacity to satisfy a wide range of user demands.

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CORSAIR Launches VENGEANCE RGB DDR5 Memory

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CORSAIR has announced VENGEANCE RGB DDR5 memory, equipping the celebrated VENGEANCE RGB, a top choice for performance enthusiasts, with DDR5 technology. Optimised for the latest gaming PCs and workstations, and available in black or white colour options, these modules deliver sensational DDR5 performance with stunning RGB style.

Launching initially in speeds up to 6,400MT/s and capacities up to 32GB (2x16GB), with frequencies up to 6,600MT/s and 2x32GB kits available soon, VENGEANCE RGB DDR5 lights up your system with a modern new design illuminated by brilliant RGB while delivering the higher frequencies, greater capacities, and faster performance of DDR5.

VENGEANCE RGB DDR5 boasts dynamic, individually addressable ten-zone RGB lighting, encased in a panoramic light bar that wraps around the top of each module. The result is a seamless light array – highly visible from a wide range of angles – illuminating your system with vivid lighting effects. Powerful CORSAIR iCUE software enables customizable RGB lighting control for detailed, synchronized lighting with the rest of your iCUE-compatible setup – or unlocking even greater immersion with real-time RGB lighting integration when playing select games.

iCUE also saves custom Intel XMP 3.0 profiles to control your memory’s performance by app or task for maximizing efficiency, as well as controlling onboard voltage regulation to achieve more finely-tuned, stable overclocking than previous generations which relied on only motherboard BIOS control. With these software features at your command, you can take your system to unprecedented levels of performance on 12th Generation Intel Core processors and select Z690 motherboards.

As with all CORSAIR DDR5 memory, VENGEANCE RGB DDR5 modules are built with only hand-sorted, tightly-screened memory chips to ensure consistently high frequencies, atop performance PCBs for excellent signal quality and stability. Cooling these chips is a stylish solid aluminium heat spreader that efficiently conducts heat away from your memory while complementing your system’s modern aesthetic. A limited lifetime warranty grants you peace of mind that your new memory will last throughout your PC’s lifespan and future upgrades.

When it comes to cutting-edge memory performance and mesmerizing RGB to match, CORSAIR lights the way with VENGEANCE RGB DDR5. CORSAIR VENGEANCE RGB DDR5 Memory is available immediately from the CORSAIR webstore and the CORSAIR worldwide network of authorized retailers and distributors. CORSAIR VENGEANCE RGB DDR5 Memory is backed by a limited lifetime warranty, alongside the CORSAIR worldwide customer service and technical support network.

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AMD Announces Zen 4 Dragon Range and Phoenix APUs for 2023

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AMD has released an updated roadmap detailing the chipmaker’s Zen 4 plans. Dragon Range and Phoenix are mobile Zen 4 APUs that will replace AMD’s existing Ryzen 6000 (Rembrandt) product line. Dragon Range will power enthusiast gaming laptops, whereas Phoenix targets thin and light gaming devices. Surprisingly, AMD didn’t specify what process node or the type of graphics that Dragon Range and Phoenix could be using. For reference, Rembrandt is on TSMC’s 6nm manufacturing process and wields RDNA 2 graphics.

According to the AMD, Dragon Range will feature the “highest core, thread, and cache ever for a mobile gaming CPU.” Although AMD didn’t specify just how many Zen 4 cores, rumor has it that Dragon Range could potentially sport up to 16 cores, which would be insane for a gaming or workstation laptop.

Feature-wise, Dragon Range and Phoenix arrive with PCIe 5.0 support. The former, however, leverages DDR5 memory while the latter is on LPDDR5 memory. Ex-Anandtech editor Ian Cutress has confirmed with AMD that the Zen 4 chips’ “exact mem support may include other technologies to be announced later.” Furthermore, since the APUs compete in different segments, they adhere to specific thermal limits. Dragon Range, for example, features a TDP of 55W and higher, whereas Phoenix plays within the 35W to 45W range.

AMD has already given the hardware world a small teaser of Ryzen 7000 (Raphael), so we already know the processors will arrive before the end of the year to replace the Ryzen 5000 (Vermeer) stack. Like its other Zen 4 brethren, Raphael boasts support for PCIe 5.0 and DDR5 while debuting with a 65W+ TDP.

Raphael will hit the shelves in the second half of the year, and if AMD’s illustration is accurate, we may be looking at a late launch in September. In a nutshell, Raphael brings Zen 4 to the mainstream market, commanding TSMC’s 5nm process node and a new AM5 platform. Unfortunately, the AM5 platform may be costly for consumers as we’ve confirmed with multiple sources that Raphael only supports DDR5 memory, which currently carries a hefty premium.

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