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Qualcomm to Move Beyond Processors to Platforms

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Reporting from San Diego, California, US: Qualcomm has announced new initiatives and changes to its strategies, at its Snapdragon 835 benchmarking event. At the event, which was held on March 15, 2017, at its head quarters in San Diego, California, US, the company took the audience through a series of changes in its product branding positioning.

“For decades, the semiconductor industry has used the term “processor” to mean the component that powers the most advanced devices,” explained Don McGuire, the VP of Product Marketing at Qualcomm Technologies, Inc.  “It’s a word that Qualcomm Technologies has embraced over the years with our Snapdragon brand, or as we say — our Qualcomm Snapdragon processor.”

Maguire further went on to say that describing Snapdragon as a “processor” is an inadequate representation. “In truth, Snapdragon is more than a single component, a piece of silicon, or what many would misinterpret as the CPU; it’s an anthology of technology, composed of hardware, software, and services that are not fully captured in a word like ‘processor.’ That is why Qualcomm Technologies is refining our terminology by referring to Snapdragon as a ‘platform’ instead of a processor,” said McGuire.

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According to McGuire, the Snapdragon platform will take the company’s offerings beyond a single chip. While the single processor form factor is truly a system-on-a-chip (SoC), housing custom technology such as an integrated modem, CPU, GPU, and DSP, there is a lot more going on outside of the chip that is designed to ultimately support a wide variety of devices.

Technologies from the RF Front End — without which mobile devices won’t be able to acquire a signal, make a phone call, or surf the web — to Qualcomm Quick Charge, the Qualcomm Aqstic audio DAC, Wi-Fi (802.11ac and 11ad), touch controllers, and finger print technology, are all engineered to work together with the SoC.

McGuire also announced that moving forward, only premium mobile platforms will retain the Snapdragon brand. This means that the company’s processors in the 200 tier will fall under the new Qualcomm Mobile name. “Our belief is that bringing the 200-level mobile platforms under the new Qualcomm Mobile brand will help differentiate entry-level and high- volume solutions from our flagship and high-end Snapdragon premium mobile experience platforms,” added McGuire.

According to Qualcomm, as it expands its presence outside of mobile, it wants the nomenclature to reflect all the product segments it is present in. From mobile PCs and servers, to automotive, IP cameras, drones, and VR/AR headsets, among others.

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CORSAIR Intros 30mm Thick RS MAX Series PC Fans

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CORSAIR has announced the launch of its first 30mm-thick PC cooling fans, the RS MAX Series. By combining extremely durable Liquid Crystal Polymer material with a larger fan blade bolstered by AirGuide technology, CORSAIR’s expert engineers have created its best-performing fan with zero compromises.

The RS MAX Series connects with a simple 4-pin PWM header, enabling precise adjustment over fan speeds without the need for a separate controller.

With a 20% increase in thickness over standard fans, the RS MAX Series can spin at a lower speed to generate the same airflow as its thinner counterparts – translating into lower overall fan noise.

For enthusiasts who push their systems to the limit, the high static pressure created by the RS MAX’s larger fan blade helps power airflow through obstructions and dense radiators, making it an ideal choice for high-performance liquid cooling setups.

CORSAIR Magnetic Dome bearings – an evolution of the acclaimed magnetic levitation bearing – significantly reduce friction for both enhanced longevity and quieter operation. For PC builders looking to boost performance without boosting noise, the RS MAX Series will help push your system to the max.

The CORSAIR RS MAX Series is available in 120mm and 140mm sizes from the CORSAIR webstore and the CORSAIR worldwide network of authorized retailers and distributors.

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TEAMGROUP Launches the MP44Q M.2 PCIe 4.0 SSD

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Team Group has launched TEAMGROUP MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs. TEAMGROUP MP44Q M.2 PCIe 4.0 SSD utilises the latest 3D QLC NAND, offering capacities of up to 4TB. With the PCIe Gen4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively.

The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with TEAMGROUP’s exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD’s lifespan.

Additionally, it supports TEAMGROUP’s exclusively patented SSD intelligent monitoring software, S.M.A.R.T., allowing for quick and easy configuration and testing, effortlessly monitoring the quality and performance of the SSD. The product also provides the latest QLC high-speed Gen4 x4 SSD to cater to various storage needs for both life and work.

The packaging of TEAMGROUP MP44Q M.2 PCIe 4.0 SSD adopts recyclable packaging materials and has passed RoHS, REACH, and other environmental protection certifications with the effort of contributing to sustainable living. The product comes with a comprehensive 5-year warranty, ensuring consumer confidence in product quality. It is expected to be available globally starting in early May 2024.

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Gigabyte Unveils Limited Edition “Ice” Themed Motherboard and GPU

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Gigabyte has officially launched its long-awaited XTREME Prestige Limited Edition lineup, featuring a visually stunning and overclocked RTX 4080 SUPER graphics card and a feature-packed Z790 motherboard. Both components boast a luxurious titanium and gold design, complete with unique engraved serial numbers, hinting at the limited production run – estimated between 300 and 500 units.

The centrepiece, the Aorus GeForce RTX 4080 Super Xtreme Ice 16G, boasts a factory overclock of 150 MHz and improved performance over the stock model. Gigabyte claims it delivers 885 AI TOPs compared to the stock card’s 836. Cooling this beast are three massive “bionic shark” fans and a large vapour chamber. For those seeking ultimate customization, the fans feature addressable RGB rings, and the card itself sports an LCD monitor displaying customizable GIFs.

The Z790 Aorus Xtreme X Ice motherboard complements the graphics card perfectly. It boasts a unique crystalized titanium finish, a golden CPU socket, and a removable M.2 heatsink. Feature-wise, it supports DDR5 memory with speeds exceeding XMP-8266 and offers AI-powered CPU overclocking, promising speeds exceeding 6.3 GHz on an i9-14900KS. An included external DAC further boosts audio quality.

While pricing remains a mystery (promised on the Gigabyte website but currently unavailable), expect a hefty price tag, likely exceeding $1,299 for the graphics card alone. Both products will be sold separately, but a future bundle with additional Xtreme Ice components is a possibility.

Gigabyte promises a luxurious “unboxing experience” for each component, complete with premium packaging, high-end tools, and even anti-static gloves. We’ll update this story with confirmed pricing when available.

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