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Qualcomm to Move Beyond Processors to Platforms

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Reporting from San Diego, California, US: Qualcomm has announced new initiatives and changes to its strategies, at its Snapdragon 835 benchmarking event. At the event, which was held on March 15, 2017, at its head quarters in San Diego, California, US, the company took the audience through a series of changes in its product branding positioning.

“For decades, the semiconductor industry has used the term “processor” to mean the component that powers the most advanced devices,” explained Don McGuire, the VP of Product Marketing at Qualcomm Technologies, Inc.  “It’s a word that Qualcomm Technologies has embraced over the years with our Snapdragon brand, or as we say — our Qualcomm Snapdragon processor.”

Maguire further went on to say that describing Snapdragon as a “processor” is an inadequate representation. “In truth, Snapdragon is more than a single component, a piece of silicon, or what many would misinterpret as the CPU; it’s an anthology of technology, composed of hardware, software, and services that are not fully captured in a word like ‘processor.’ That is why Qualcomm Technologies is refining our terminology by referring to Snapdragon as a ‘platform’ instead of a processor,” said McGuire.

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According to McGuire, the Snapdragon platform will take the company’s offerings beyond a single chip. While the single processor form factor is truly a system-on-a-chip (SoC), housing custom technology such as an integrated modem, CPU, GPU, and DSP, there is a lot more going on outside of the chip that is designed to ultimately support a wide variety of devices.

Technologies from the RF Front End — without which mobile devices won’t be able to acquire a signal, make a phone call, or surf the web — to Qualcomm Quick Charge, the Qualcomm Aqstic audio DAC, Wi-Fi (802.11ac and 11ad), touch controllers, and finger print technology, are all engineered to work together with the SoC.

McGuire also announced that moving forward, only premium mobile platforms will retain the Snapdragon brand. This means that the company’s processors in the 200 tier will fall under the new Qualcomm Mobile name. “Our belief is that bringing the 200-level mobile platforms under the new Qualcomm Mobile brand will help differentiate entry-level and high- volume solutions from our flagship and high-end Snapdragon premium mobile experience platforms,” added McGuire.

According to Qualcomm, as it expands its presence outside of mobile, it wants the nomenclature to reflect all the product segments it is present in. From mobile PCs and servers, to automotive, IP cameras, drones, and VR/AR headsets, among others.

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TEAMGROUP Launches the Upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler with LGA 1700 Compatibility

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TEAMGROUP has announced the new SIREN GD240E All-In-One ARGB CPU Liquid Cooler, which comes with a mounting bracket for the latest LGA 1700 socket and fully supports 12th Generation Intel processors and Z690 motherboards, making it a must-have cooling solution for gamers. Launched alongside the CPU cooling system is the M200 Portable SSD, winner of Japan’s 2021 GOOD DESIGN Award. Hardcore gamers around the world can look forward to both products when they are released globally this December.

The newly upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler not only supports various older Intel and AMD sockets but also provides a mounting kit for the latest LGA 1700 socket. The specially selected base plate, support screws, and mounting brackets enable the water block to fit snugly with the processor. The full and even contact between the surfaces aids heat transfer swiftly to the high-density jet fin heat sink, greatly increasing the heat dissipation area and quickly removing heat from the CPU.

To optimise efficiency and the path of heat transfer, the SIREN GD240E is equipped with an ultra-fast 4000RPM water pump that’s installed on the radiator to reduce wear and noise on the CPU caused by water pump vibrations. These features allow the system to deliver 1.5 times higher cooling performance than typical liquid-cooled products while also providing the best protection for the next-gen Intel processors. The SIREN GD240E is an all-in-one liquid cooler system with top-notch heat dissipation and visual flair thanks to the water block’s elegant mirror finish and high-speed ARGB fans that support all major motherboard lighting software.

The M200 Portable SSD has a USB 3.2 Gen 2×2 interface, which delivers a blazing fast speed of 2,000MB/s, four times that of USB 3.2 Gen 1 external SSDs. It also features USB Type A and Type C OTG capabilities and supports a wide range of platforms, including tablets, smartphones, and PlayStation and Xbox consoles. With a total weight of only 83 grams and a maximum capacity of 8TB, the M200 Portable SSD is lightweight and portable, giving you easy access to fast drive speeds and massive storage at any time.

The upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler provides a new CPU cooling option for the latest Intel platform, and the high-speed M200 Portable SSD offers two different transmission interfaces, so consumers with large capacity storage needs can buy with confidence. These two new products will be available worldwide in December 2021.

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TEAMGROUP Launches T-Force Delta RGB DDR5 and Vulcan DDR5

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TEAMGROUP, the leading brand in the global memory product market is introducing the highly anticipated T-FORCE DELTA RGB DDR5 and T-FORCE VULCAN DDR5 desktop memory. The phenomenal speed and visualization properties of DELTA RGB DDR5 reach an exceptional maximum frequency of 6,400MHz and have recently been verified by major motherboard manufacturers to be compatible with their lighting control software. Meanwhile, the maximum frequency of VULCAN DDR5 is 5,200MHz. Marking a new page in the DDR5 series, the two newly developed products with pioneering specifications will be available globally this month on Newegg and Amazon.

T-FORCE DELTA RGB DDR5 overclocking memory is equipped with a power management IC with professional thermal conductive silicone rubber to enhance heat dissipation. It also supports on-die ECC error correction code to deliver stability and efficiency in power and system operations. The dual-channel memory offers a 2x16GB capacity, and consumers can choose from two frequency specifications, 6,000MHz and 6,400MHz. T-FORCE DELTA RGB DDR5 desktop memory sustains the series original geometric design featuring optimized simplicity in its silhouette inspired by stealth aircraft. The RGB intelligent control chip and 120° ultra-wide range illumination properties allow users to effortlessly immerse in DDR5 memory’s extraordinary performance and distinguishing visualization.

T-FORCE VULCAN DDR5 overclocking desktop memory is a one-piece aluminum alloy manufactured through stamping designed to be installed via the snap on the top. Equipped with professional thermal conductive silicone rubber, it boasts a strengthened structure and enhanced heat-dissipating efficiency. T-FORCE VULCAN DDR5 offers a dual-channel capacity of 2x16GB in two frequency specifications, 4,800MHz and 5,200MHz. Power management IC and on-die ECC error correction code enhance efficiency in power management, stability and performance in computing power. The global debut of the latest developed overclocking memory, T-FORCE DELTA RGB DDR5 and T-FORCE VULCAN DDR5, will be available globally this month to meet global users’ demand for ultimate performance.

 

 

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Intel Marks 50th Anniversary of the Intel 4004

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Today, Intel celebrates the 50th anniversary of the Intel® 4004, the world’s first commercially available microprocessor. With its launch in November 1971, the 4004 paved the path for modern microprocessor computing – the “brains” that make possible nearly every modern technology, from the cloud to the edge. Microprocessors enable the convergence of the technology superpowers – ubiquitous computing, pervasive connectivity, cloud-to-edge infrastructure, and artificial intelligence – and create a pace of innovation that is moving faster today than ever.

The 4004 is the pioneer microprocessor, and its success proved that it was possible to build complex integrated circuits and fit them on a chip the size of a fingernail.

Its invention also established a new random logic design methodology, one that subsequent generations of microprocessors would be built upon, before evolving to create the chips found in today’s modern devices.

“[Looking back at] 1970, it was clear that microprocessors would change the way that we design systems, switching from using hardware to software instead. But the speed with which microprocessors developed over time and were adopted by the industry was really surprising,” said Federico Faggin, former Intel engineer who designed and produced the Intel 4004 with Tedd Hoff and Stan Mazor.

While the 4004 delivered the modern computing era through the design and production of the first commercially available microprocessor for a desktop calculator, the latest 12th Gen Intel® Core™ processors – which company leaders revealed at the Intel Innovation event in October – will usher in a new era of computing. The performance hybrid architecture of this new family represents an architectural shift made possible by close co-engineering of software and hardware and will deliver new levels of leadership performance for generations. And with research in fields like quantum computing, with the cryogenic Intel Horse Ridge II solution, and neuromorphic computing, with the Intel Loihi 2 chip, Intel continues to innovate, explore new territories and push the limits of computing.

In 1969, Nippon Calculating Machine Corp. approached Intel about designing a set of integrated circuits for its engineering prototype calculator, the Busicom 141-PF. Intel engineer Faggin and his team adapted the original plans for 12 custom chips and designed a set of four chips – including the 4004 CPU – that met the challenge. Ultimately, the 4004, at the size of a human fingernail, delivered the same computing power as the first electronic computer built in 1946, which filled an entire room.

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