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Qualcomm Snapdragon 835 Benchmarking Results: Here’s What You Need to Know

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Last week, Review Central was at Qualcomm’s San Diego campus, putting the new Qualcomm Snapdragon 835 chip to test. The Snapdragon 835 already powers the new Sony Xperia XZ Premium, which we saw at Mobile World Congress 2017. The 835 chip is also expected to power a long list of upcoming smartphones, including the Samsung Galaxy S8, HTC 11, Microsoft Surface Phone, Xiaomi Mi 6, Nokia 8, OnePlus 4/5, LG V30, and Pixel 2, among others.

So What Does Snapdragon 835 Bring Along?
The Snapdragon 835 is made using the 10nm process and hence it is even smaller than its predecessor, the 14nm Snapdragon 821. This is really a huge achievement, especially since Samsung is the first manufacturer building the 10nm chips, even sooner than Intel and TMSC.

Most flagship smartphones in 2017 are expected to be powered by the new SoC. The smaller chip will spare room for other features, house a bigger battery, or just to make devices smaller and slimmer. Compared to the Snapdragon 821, the 835 has achieved 30 percent increase in area efficiency, 27 percent higher performance, and 40 percent less consumption of battery.

The more advanced design will give us a significant battery life improvement. The Snapdragon 835 also features Quick Charge 4 which could give our smartphones extra 5 hours of usage with just 5 minutes of charging, or reach 50 percent in 15 minutes. And the good news is that Quickcharge 4.0 is compatible with Google’s specs for USB Type-C charging.

The CPU is the Octacore Kryo 280, which includes four cores with 2.45GHz threshold and four with a 1.9GHz threshold. It also supports one 32-megapixel camera or 16-megapixel dual camera, Bluetooth 5, 4K Ultra HD premium video, and better VR experience with the Adreno 540 GPU.

All in all, with the new Snapdragon 835, you can expect to get better battery life, Quick Charge 4, better graphics performance, and faster wireless capabilities. The new chip also supposedly offers better camera capabilities with Qualcomm’s very own EIS (electronic image stablisation) 3.0 tech built-in. The new chip also offers better audio since it now supports 32-bit, 384KHz audio DACs.

The Snapdragon 835 also have dual camera capability built-in. The chip also comes with a bunch of security features called Qualcomm Haven – this capability allows you to bolster security in various ways. This includes keeping track of suspicious app behaviour and locking them down before they do any harm.

The Qualcomm Snapdragon 835 Reference Device
Qualcomm handed us a reference device (prototype) running the new Snapdragon 835 chip. The reference device did not include any active cooling components. In addition, the device was also very thick – so all that may have helped the chip run better and get better cooling.

Do remember to take these benchmark results with a grain of salt. A reference device is not a retail product. Hence, it doesn’t have to worry about things such as  proper cooling or decent battery life. We will revisit the benchmarks once vendors start flooding the markets with finished smartphones running the Snapdragon 835 chip.

AnTuTu Benchmark v6.2.7
We ran the AnTuTu benchmark on the reference device running Qualcomm Snapdragon 835 chip and we came away surprised. The benchmark gave the performance crown to the 835 chip, as you can see below:

AnTutu 1

It’s even faster than the iPhone 7 and the iPhone 7 Plus. However the launch of the iPhone 8 is expected to be pretty soon – so this might all change. For now, according to the AnTuTu benchmarks, Qualcomm’s Snapdragon 835 is the king.

Geekbench v4.0
We also looked at Geekbench 4. This test covers single-core performance, which lets you know how fast a phone will feel in everyday tasks. We also ran the multi-core performance test, which checks out video and photo editing.

Geekbench 1

In terms of single-core performance, the Snapdragon 835 did an amazing job. The 835 also did well in the multi-core tests.

3DMark Ice Storm Unlimited
3DMark is a very popular graphics benchmark utility on desktops. However, recently, the mobile version has picked up steam. Here too, the Snapdragon 835 did a brilliant job of passing the tests with flying colours.

3DMark Slingshot 3.1

The Benchmarking Result Analysis
Overall, the Qualcomm Snapdragon 835 is an excellent performer.  Qualcomm deserves a pat in the back for opting to go with the 10nm process for manufacturing the chip. This will make the chip more efficient while doing the same work when compared to a Snapdragon 821.

In addition, the Adreno 540 is also considerably faster than the GPU in the 820-series Snapdragons. However, there are plenty of unknowns right now. The lower power consumption figures and faster charging are as-yet untested by us, and beyond raw performance, will be key when it comes to making a buying decision.

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TEAMGROUP Launches the Upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler with LGA 1700 Compatibility

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TEAMGROUP has announced the new SIREN GD240E All-In-One ARGB CPU Liquid Cooler, which comes with a mounting bracket for the latest LGA 1700 socket and fully supports 12th Generation Intel processors and Z690 motherboards, making it a must-have cooling solution for gamers. Launched alongside the CPU cooling system is the M200 Portable SSD, winner of Japan’s 2021 GOOD DESIGN Award. Hardcore gamers around the world can look forward to both products when they are released globally this December.

The newly upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler not only supports various older Intel and AMD sockets but also provides a mounting kit for the latest LGA 1700 socket. The specially selected base plate, support screws, and mounting brackets enable the water block to fit snugly with the processor. The full and even contact between the surfaces aids heat transfer swiftly to the high-density jet fin heat sink, greatly increasing the heat dissipation area and quickly removing heat from the CPU.

To optimise efficiency and the path of heat transfer, the SIREN GD240E is equipped with an ultra-fast 4000RPM water pump that’s installed on the radiator to reduce wear and noise on the CPU caused by water pump vibrations. These features allow the system to deliver 1.5 times higher cooling performance than typical liquid-cooled products while also providing the best protection for the next-gen Intel processors. The SIREN GD240E is an all-in-one liquid cooler system with top-notch heat dissipation and visual flair thanks to the water block’s elegant mirror finish and high-speed ARGB fans that support all major motherboard lighting software.

The M200 Portable SSD has a USB 3.2 Gen 2×2 interface, which delivers a blazing fast speed of 2,000MB/s, four times that of USB 3.2 Gen 1 external SSDs. It also features USB Type A and Type C OTG capabilities and supports a wide range of platforms, including tablets, smartphones, and PlayStation and Xbox consoles. With a total weight of only 83 grams and a maximum capacity of 8TB, the M200 Portable SSD is lightweight and portable, giving you easy access to fast drive speeds and massive storage at any time.

The upgraded SIREN GD240E AIO ARGB CPU Liquid Cooler provides a new CPU cooling option for the latest Intel platform, and the high-speed M200 Portable SSD offers two different transmission interfaces, so consumers with large capacity storage needs can buy with confidence. These two new products will be available worldwide in December 2021.

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TEAMGROUP Launches T-Force Delta RGB DDR5 and Vulcan DDR5

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TEAMGROUP, the leading brand in the global memory product market is introducing the highly anticipated T-FORCE DELTA RGB DDR5 and T-FORCE VULCAN DDR5 desktop memory. The phenomenal speed and visualization properties of DELTA RGB DDR5 reach an exceptional maximum frequency of 6,400MHz and have recently been verified by major motherboard manufacturers to be compatible with their lighting control software. Meanwhile, the maximum frequency of VULCAN DDR5 is 5,200MHz. Marking a new page in the DDR5 series, the two newly developed products with pioneering specifications will be available globally this month on Newegg and Amazon.

T-FORCE DELTA RGB DDR5 overclocking memory is equipped with a power management IC with professional thermal conductive silicone rubber to enhance heat dissipation. It also supports on-die ECC error correction code to deliver stability and efficiency in power and system operations. The dual-channel memory offers a 2x16GB capacity, and consumers can choose from two frequency specifications, 6,000MHz and 6,400MHz. T-FORCE DELTA RGB DDR5 desktop memory sustains the series original geometric design featuring optimized simplicity in its silhouette inspired by stealth aircraft. The RGB intelligent control chip and 120° ultra-wide range illumination properties allow users to effortlessly immerse in DDR5 memory’s extraordinary performance and distinguishing visualization.

T-FORCE VULCAN DDR5 overclocking desktop memory is a one-piece aluminum alloy manufactured through stamping designed to be installed via the snap on the top. Equipped with professional thermal conductive silicone rubber, it boasts a strengthened structure and enhanced heat-dissipating efficiency. T-FORCE VULCAN DDR5 offers a dual-channel capacity of 2x16GB in two frequency specifications, 4,800MHz and 5,200MHz. Power management IC and on-die ECC error correction code enhance efficiency in power management, stability and performance in computing power. The global debut of the latest developed overclocking memory, T-FORCE DELTA RGB DDR5 and T-FORCE VULCAN DDR5, will be available globally this month to meet global users’ demand for ultimate performance.

 

 

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Intel Marks 50th Anniversary of the Intel 4004

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Today, Intel celebrates the 50th anniversary of the Intel® 4004, the world’s first commercially available microprocessor. With its launch in November 1971, the 4004 paved the path for modern microprocessor computing – the “brains” that make possible nearly every modern technology, from the cloud to the edge. Microprocessors enable the convergence of the technology superpowers – ubiquitous computing, pervasive connectivity, cloud-to-edge infrastructure, and artificial intelligence – and create a pace of innovation that is moving faster today than ever.

The 4004 is the pioneer microprocessor, and its success proved that it was possible to build complex integrated circuits and fit them on a chip the size of a fingernail.

Its invention also established a new random logic design methodology, one that subsequent generations of microprocessors would be built upon, before evolving to create the chips found in today’s modern devices.

“[Looking back at] 1970, it was clear that microprocessors would change the way that we design systems, switching from using hardware to software instead. But the speed with which microprocessors developed over time and were adopted by the industry was really surprising,” said Federico Faggin, former Intel engineer who designed and produced the Intel 4004 with Tedd Hoff and Stan Mazor.

While the 4004 delivered the modern computing era through the design and production of the first commercially available microprocessor for a desktop calculator, the latest 12th Gen Intel® Core™ processors – which company leaders revealed at the Intel Innovation event in October – will usher in a new era of computing. The performance hybrid architecture of this new family represents an architectural shift made possible by close co-engineering of software and hardware and will deliver new levels of leadership performance for generations. And with research in fields like quantum computing, with the cryogenic Intel Horse Ridge II solution, and neuromorphic computing, with the Intel Loihi 2 chip, Intel continues to innovate, explore new territories and push the limits of computing.

In 1969, Nippon Calculating Machine Corp. approached Intel about designing a set of integrated circuits for its engineering prototype calculator, the Busicom 141-PF. Intel engineer Faggin and his team adapted the original plans for 12 custom chips and designed a set of four chips – including the 4004 CPU – that met the challenge. Ultimately, the 4004, at the size of a human fingernail, delivered the same computing power as the first electronic computer built in 1946, which filled an entire room.

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