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AMD Announces New Products at Computex 2019 Keynote

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AMD today again made technology history with the announcement of high-performance 7nm-based computing and graphics products that are expected to deliver new levels of performance, features and experiences for PC gamers, enthusiasts and content creators. During the first-ever Computex opening keynote, AMD President and CEO Dr. Lisa Su announced:

AMD today again made technology history with the announcement of high-performance 7nm-based computing and graphics products that are expected to deliver new levels of performance, features, and experiences for PC gamers, enthusiasts and content creators. During the first-ever Computex opening keynote, AMD President and CEO Dr. Lisa Su announced:

  • The new “Zen 2” core widely outperforms the historical generational performance improvement industry trend, up to 15% estimated instructions per clock (IPC) uplift over the predecessor “Zen” architecture. The “Zen 2” CPU core powering the next-generation AMD Ryzen and EPYC processors also include significant design improvements including larger cache sizes and a redesigned floating point engine.
  • The 3rd Gen AMD Ryzen desktop processor family, including the new 12-core Ryzen 9 processor, offers leadership performance.
  • The AMD X570 chipset for socket AM4, the world’s first PCIe 4.0 supported chipset with more than 50 new motherboards at launch.
  • RDNA gaming architecture designed to drive the future of PC gaming, console, and cloud, anticipated delivering incredible performance, power, and memory efficiency in a smaller package.
  • The 7nm AMD Radeon RX 5700-series gaming graphics card family featuring high-speed GDDR6 memory and support for the PCIe 4.0 interface.

Dr. Su was joined by fellow technology leaders Microsoft Corporate Vice President of OS Platforms Roanne Sones, Asus Chief Operating Officer Joe Hsieh, Acer Co-Chief Operating Officer Jerry Kao and a host of other significant industry players to showcase the breadth and depth of the AMD high-performance computing and graphics ecosystem.

“2019 is off to an incredible start for AMD as we celebrate 50 years of innovation by delivering leadership products to push the limits of what is possible with computing and graphics technology,” said Dr. Su. “We made significant strategic investments in next-generation cores, a breakthrough chiplet design approach, and advanced process technologies to deliver leadership 7nm products to our high-performance computing ecosystem. We are extremely excited to kick-off Computex 2019 together with our industry partners as we prepare to bring our next generation of Ryzen desktop and EPYC server processors and Radeon RX gaming graphics cards to market.”             

AMD High-Performance Desktop Updates
Continuing its path of PC leadership and industry firsts, AMD announced the 3rd Gen AMD Ryzen desktop processor, the most advanced desktop processor in the world with ground-breaking performance across gaming, productivity, and content creation applications. Based on the new “Zen 2” core architecture with AMD chiplet design approach, 3rd Gen AMD Ryzen desktop processors are expected to offer more performance-critical on-die cache than ever before to unleash elite gaming performance. 

Additionally, all 3rd Gen Ryzen desktop processors are supported by the world’s first PCIe 4.0 PC readiness for the most advanced motherboards, graphics, and storage technologies available, setting a new standard of performance and providing the ultimate consumer experience. With the 3rd Gen AMD Ryzen desktop processor family, AMD introduced a new category of Ryzen 9 desktop processor with the flagship 12 core/24 thread Ryzen 9 3900X. 

Pushing the high-performance envelope for socket AM4 by offering leadership performance, the family is rounded out with 8 core Ryzen 7 models and 6 core Ryzen 5 models. During the keynote, Dr. Su showed various live demonstrations highlighting the leadership performance of the 3rd Gen Ryzen desktop processors versus competitive production parts:

  • Ryzen 7 3700X vs. i7-9700K with real-time rendering: The Ryzen 7 3700X offered 1% more single-threaded, and 30% more in multi-threaded performance.
  • Ryzen 7 3800X vs. i9-9900K with PlayerUnknown’s Battlegrounds gameplay: The Ryzen 7 3800X matched the performance of the i9-9900K.
  • Ryzen 9 3900X vs. i9-9920X with Blender Render: The Ryzen 9 3900X beat the Intel i9 9920X by more than 16%.

AMD also introduced a new X570 chipset for socket AM4, supporting the world’s first PCIe 4.0 readiness, which exhibited 42% faster storage performance than PCIe 3.0, enabling high-performance graphics card, networking devices, NVMe drives, and more. With PCIe 4.0 doubling the bandwidth for motherboards with the X570 chipset over PCIe 3.0, PC enthusiasts can gain more performance and flexibility when building custom systems. 

The X570 offers the broadest ecosystem readiness in AMD history, with over 50 new motherboard models anticipated from ASRock, Asus, Colorful, Gigabyte, MSI, as well as PCIe 4.0 storage solutions from partners including Galaxy, Gigabyte, and Phison. The 3rd Gen AMD Ryzen desktop processors are expected to be available for purchase globally on July 7, 2019. 

In addition, major OEMs and System Integrators, including Acer, Asus, CyberPowerPC, HP, Lenovo, and MAINGEAR reinforced strong ecosystem support for the new platforms by announcing plans to offer 3rd Gen AMD Ryzen processor-based gaming desktop systems over the coming months.

AMD High-Performance Gaming Updates
AMD unveiled RDNA, the next foundational gaming architecture that was designed to drive the future of PC gaming, console, and cloud for years to come. With a new compute unit design, RDNA is expected to deliver incredible performance, power and memory efficiency in a smaller package compared to the previous generation Graphics Core Next (GCN) architecture. 

It is projected to provide up to 1.25X higher performance-per-clock and up to 1.5X higher performance-per-watt over GCN, enabling better gaming performance at lower power and reduced latency. RDNA will power the upcoming 7nm AMD Radeon RX 5700-series graphics cards which feature high-speed GDDR6 memory and support for the PCIe 4.0 interface.

During the keynote, Dr. Su showcased the power of RDNA and one of the new AMD Radeon RX 5700-series graphics cards in a head-to-head comparison with an RTX 2070 card running a Strange Brigade gameplay demo, beating the competition delivering incredible ~100 FPS gaming. AMD Radeon RX 5700-series graphics cards are expected to be available in July 2019. Learn more at the AMD E3 livestream event on June 10, 2019, at 3 pm PT.

AMD Datacenter Updates
The AMD datacenter business continues to gain traction with customers, winning in application workloads from the biggest cloud environments to exascale supercomputing, and capitalizing on the massive market opportunity for both AMD EPYC and AMD Radeon Instinct processors. During the keynote, Dr. Su continued the anticipation around the next-generation AMD EPYC processors with the first public competitive demonstration of a 2nd Gen AMD EPYC server platform. 

The demonstration showed a 2P 2nd Gen AMD EPYC based server vs. a 2P Intel Xeon8280-based server running a NAMD Apo1 v2.12 benchmark test. The preproduction 2nd Gen AMD EPYC processor-powered server outperformed the Intel Xeon powered servers by more than 2x on the NAMD benchmark. 

Finally, Microsoft Azure announced the achievement of previously unobtainable levels of performance for computational fluid dynamics (CFD) using an Azure HB cloud instance running on a 1st Gen AMD EPYC-processor-based system. Leveraging the exceptional memory bandwidth of AMD EPYC, Azure HB scaled Siemens Star -CCM+ application across over 11,500 cores using a Le Mans 100 Million Cell simulation, well beyond the never before achieved 10,000 cores goal. 

“HB-series VMs on Azure are a game changer for HPC in the cloud. For the first time, HPC customers can scale their MPI workloads to tens of thousands of cores with the agility of the cloud and performance and economics that rival on-premise cluster,” said Navneet Joneja, head of product for Azure Virtual Machines, Microsoft Corp. “We look forward to this new Azure offering doing great things for HPC-driven innovation and productivity.”

The 2nd Gen AMD EPYC server processor family is projected to deliver up to 2X the performance-per socket and up to 4X the floating performance-per-socket over the previous generation. The 2nd Gen AMD EPYC server processor family is expected to launch in Q3 2019.

  • The new “Zen 2” core widely outperforms the historical generational performance improvement industry trend, up to 15% estimated instructions per clock (IPC) uplift over the predecessor “Zen” architecture. The “Zen 2” CPU core powering the next-generation AMD Ryzen and EPYC processors also includes significant design improvements including lager cache sizes and a redesigned floating point engine.
  • The 3rd Gen AMD Ryzen desktop processor family, including the new 12-core Ryzen 9 processor, offers leadership performance.
  • The AMD X570 chipset for socket AM4, the world’s first PCIe 4.0 supported chipset with more than 50 new motherboards at launch.
  • RDNA gaming architecture designed to drive the future of PC gaming, console, and cloud, anticipated to deliver incredible performance, power, and memory efficiency in a smaller package.
  • The 7nm AMD Radeon RX 5700-series gaming graphics card family featuring high-speed GDDR6 memory and support for the PCIe 4.0 interface.

Dr. Su was joined by fellow technology leaders Microsoft Corporate Vice President of OS Platforms Roanne Sones, Asus Chief Operating Officer Joe Hsieh, Acer Co-Chief Operating Officer Jerry Kao and a host of other significant industry players to showcase the breadth and depth of the AMD high-performance computing and graphics ecosystem.

“2019 is off to an incredible start for AMD as we celebrate 50 years of innovation by delivering leadership products to push the limits of what is possible with computing and graphics technology,” said Dr. Su. “We made significant strategic investments in next-generation cores, a breakthrough chiplet design approach, and advanced process technologies to deliver leadership 7nm products to our high-performance computing ecosystem. We are extremely excited to kick-off Computex 2019 together with our industry partners as we prepare to bring our next generation of Ryzen desktop and EPYC server processors and Radeon RX gaming graphics cards to market.”             

AMD High-Performance Desktop Updates
Continuing its path of PC leadership and industry firsts, AMD announced the 3rd Gen AMD Ryzen desktop processor, the most advanced desktop processor in the world with ground-breaking performance across gaming, productivity, and content creation applications. Based on the new “Zen 2” core architecture with AMD chiplet design approach, 3rd Gen AMD Ryzen desktop processors are expected to offer more performance-critical on-die cache than ever before to unleash elite gaming performance. 

Additionally, all 3rd Gen Ryzen desktop processors are supported by the world’s first PCIe 4.0 PC readiness for the most advanced motherboards, graphics, and storage technologies available, setting a new standard of performance and providing the ultimate consumer experience. With the 3rd Gen AMD Ryzen desktop processor family, AMD introduced a new category of Ryzen 9 desktop processor with the flagship 12 core/24 thread Ryzen 9 3900X. 

Pushing the high-performance envelope for socket AM4 by offering leadership performance, the family is rounded out with 8 core Ryzen 7 models and 6 core Ryzen 5 models. During the keynote, Dr. Su showed various live demonstrations highlighting leadership performance of the 3rd Gen Ryzen desktop processors versus competitive production parts:

  • Ryzen 7 3700X vs. i7-9700K with real-time rendering: The Ryzen 7 3700X offered 1% more  single-threaded, and 30% more in multi-threaded performance.
  • Ryzen 7 3800X vs. i9-9900K with PlayerUnknown’s Battlegrounds gameplay: The Ryzen 7 3800X matched the performance of the i9-9900K.
  • Ryzen 9 3900X vs. i9-9920X with Blender Render: The Ryzen 9 3900X beat the Intel i9 9920X by more than 16%.

AMD also introduced a new X570 chipset for socket AM4, supporting the world’s first PCIe 4.0 readiness, which exhibited 42% faster storage performance than PCIe 3.0, enabling high-performance graphics card, networking devices, NVMe drives, and more. With PCIe 4.0 doubling the bandwidth for motherboards with the X570 chipset over PCIe 3.0, PC enthusiasts can gain more performance and flexibility when building custom systems. 

The X570 offers the broadest ecosystem readiness in AMD history, with over 50 new motherboard models anticipated from ASRock, Asus, Colorful, Gigabyte, MSI, as well as PCIe 4.0 storage solutions from partners including Galaxy, Gigabyte, and Phison. The 3rd Gen AMD Ryzen desktop processors are expected to be available for purchase globally on July 7, 2019. 

In addition, major OEMs and System Integrators, including Acer, Asus, CyberPowerPC, HP, Lenovo, and MAINGEAR reinforced strong ecosystem support for the new platforms by announcing plans to offer 3rd Gen AMD Ryzen processor-based gaming desktop systems over the coming months.

AMD High-Performance Gaming Updates
AMD unveiled RDNA, the next foundational gaming architecture that was designed to drive the future of PC gaming, console, and cloud for years to come. With a new compute unit design, RDNA is expected to deliver incredible performance, power and memory efficiency in a smaller package compared to the previous generation Graphics Core Next (GCN) architecture. 

It is projected to provide up to 1.25X higher performance-per-clock and up to 1.5X higher performance-per-watt over GCN, enabling better gaming performance at lower power and reduced latency. RDNA will power the upcoming 7nm AMD Radeon RX 5700-series graphics cards which feature high-speed GDDR6 memory and support for the PCIe 4.0 interface.

During the keynote, Dr. Su showcased the power of RDNA and one of the new AMD Radeon RX 5700-series graphics cards in a head-to-head comparison with a RTX 2070 card running a Strange Brigade gameplay demo, beating the competition delivering incredible ~100 FPS gaming. AMD Radeon RX 5700-series graphics cards are expected to be available in July 2019. Learn more at the AMD E3 livestream event on June 10, 2019 at 3 pm PT.

AMD Datacenter Updates
The AMD datacenter business continues to gain traction with customers, winning in application workloads from the biggest cloud environments to exascale supercomputing, and capitalizing on the massive market opportunity for both AMD EPYC and AMD Radeon Instinct processors. During the keynote, Dr. Su continued the anticipation around the next-generation AMD EPYC processors with the first public competitive demonstration of a 2nd Gen AMD EPYC server platform. 

The demonstration showed a 2P 2nd Gen AMD EPYC based server vs. a 2P Intel Xeon8280-based server running a NAMD Apo1 v2.12 benchmark test. The preproduction 2nd Gen AMD EPYC processor powered server outperformed the Intel Xeon powered servers by more than 2x on the NAMD benchmark. 

Finally, Microsoft Azure announced the achievement of previously unobtainable levels of performance for computational fluid dynamics (CFD) using an Azure HB cloud instance running on an 1st Gen AMD EPYC-processor based system. Leveraging the exceptional memory bandwidth of AMD EPYC, Azure HB scaled Siemens Star -CCM+ application across over 11,500 cores using a Le Mans 100 Million Cell simulation, well beyond the never before achieved 10,000 cores goal. 

“HB-series VMs on Azure are a game changer for HPC in the cloud. For the first time, HPC customers can scale their MPI workloads to tens of thousands of cores with the agility of the cloud and performance and economics that rival on-premise cluster,” saidNavneet Joneja, head of product for Azure Virtual Machines, Microsoft Corp. “We look forward to this new Azure offering doing great things for HPC-driven innovation and productivity.”

The 2nd Gen AMD EPYC server processor family is projected to deliver up to 2X the performance-per socket and up to 4X the floating performance-per-socket over the previous generation. The 2nd Gen AMD EPYC server processor family is expected to launch in Q3 2019.

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CORSAIR Adds Two New Products to its VENGEANCE RGB DDR4 Memory Lineup

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CORSAIR has today announced two new high-performance additions to its famed VENGEANCE DDR4 lineup: CORSAIR VENGEANCE RGB RT and CORSAIR VENGEANCE RGB RS. Initially available in frequencies up to 4,600MHz and kits up to 256GB for VENGEANCE RGB RT, and frequencies up to 3,600MHz and kits up to 128GB for VENGEANCE RGB RS, both ranges feature a striking new design, showcasing dynamic, panoramic RGB lighting atop reimagined modern heat spreader profiles, for eye-catching modules that befit bold PC builds. Beneath the stylish exteriors, VENGEANCE RGB RT and VENGEANCE RGB RS continue the CORSAIR legacy for performance and quality, with tightly screened memory chips optimized for peak performance and overclocking potential, all backed by a lifetime warranty.

Specially optimized for AMD DDR4 motherboards, VENGEANCE RGB RT ensures lightning-fast response times and maximum bandwidth, with the looks to match. Ten individually addressable RGB LEDs are encased in a panoramic light bar that provides unobstructed wraparound illumination, for fantastic RGB lighting from any viewing angle.

Available in gunmetal and white color variations, the module’s distinctive dual-tone solid aluminum heat spreader efficiently conducts heat away from your system. When fitted to compatible AMD motherboards, VENGEANCE RGB RT automatically configures to the maximum supported speed of your system, delivering faster load times, multitasking, and more, all without any tinkering in BIOS. Whether you’re an experienced PC builder or a first-timer, VENGEANCE RGB RT combines stunning looks and great performance, with simple AMD-friendly compatibility.

VENGEANCE RGB RS features an impressive performance on both Intel and AMD DDR4 motherboards. Six individually addressable RGB LEDs are incorporated in their own panoramic light bar, smoothly diffusing RGB lighting for vivid preset or custom lighting effects. An aluminum heat spreader efficiently disperses heat during even the most strenuous tasks, so you can push your memory to the limits without breaking a sweat. VENGEANCE RGB RS also supports Intel XMP 2.0, activating higher frequencies and performance with simple one-setting installation and setup.

Both VENGEANCE RGB RT and RS continue the legacy of high-frequency performance and reliability for which CORSAIR memory is world-renowned. Utilizing a custom PCB for high signal quality and stability, each memory chip is carefully screened and selected for performance and overclocking potential. Both modules’ RGB lighting is massively customizable through CORSAIR iCUE software and can be synchronized with all iCUE-compatible devices throughout your setup for stunning lighting effects across the iCUE ecosystem. For remarkable DDR4 performance in a striking new design, VENGEANCE RGB RT and VENGEANCE RGB RS will visualize, synchronize, and mesmerize.

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Intel Intros New High-Performance Graphics Brand Called Intel Arc

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Intel has revealed the brand for its upcoming consumer high-performance graphics products: Intel Arc. The Arc brand will cover hardware, software and services, and will span multiple hardware generations, with the first generation, based on the Xe HPG microarchitecture, code-named Alchemist (formerly known as DG2).

Intel also revealed the code names of future generations under the Arc brand: Battlemage, Celestial and Druid. “Today marks a key moment in the graphics journey we started just a few years ago. The launch of the Intel Arc brand and the reveal of future hardware generations signifies Intel’s deep and continued commitment to gamers and creators everywhere. We have teams doing incredible work to ensure we deliver first-class and frictionless experiences when these products are available early next year,” said Roger Chandler, Intel vice president and general manager of Client Graphics Products and Solutions.

Intel Xe is a scalable graphics and compute architecture designed to deliver exceptional performance and functionality spanning integrated to discrete and data centers to supercomputers. Upcoming Intel Arc Graphics products are based on the Xe HPG microarchitecture, a convergence of Intel’s Xe LP, HP and HPC microarchitectures, that will deliver scalability and compute efficiency with advanced graphics features.

The first generation of Intel Arc products, code-named Alchemist, will feature hardware-based ray tracing and artificial intelligence-driven super sampling, and offer full support for DirectX 12 Ultimate. Intel’s long-term vision is to bring frictionless gaming and content creation experiences to gamers and creators worldwide, giving them innovation and choice in hardware coupled with open and accessible software tools. Alchemist products will arrive in the first quarter of 2022.

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Kingston’s FURY Range of Memory Products Start Shipping

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Kingston FURY, a division of Kingston Technology Europe Co LLP, an affiliate of Kingston Technology Company, Inc., announced today it has begun shipping its high-performance memory: Kingston FURY Renegade, Kingston FURY Beast, and Kingston FURY Impact. Enthusiasts and gamers can give their systems the upgrade they need and want with modules in DDR4 RGB, DDR4 non-RGB, and DDR3.

Perfect for the gamer who wants cutting-edge performance, Kingston FURY Renegade DDR4 RGB allows you to crank up your frame rate, keep your streams broadcasting smoothly, and plough through your highlight reel editing. Offering speeds up to 4600MHz2 paired with quick CL15-CL19 latencies. The dynamic RGB lighting utilises Kingston FURY’s patented Infrared Sync Technology to provide smooth, synchronised lighting effects. With its own aggressive, stylish black heat spreader and matching black PCB Kingston FURY Renegade DDR4 also provides ultra-fast speeds up to 5333MHz, paired with quick CL13-CL20 timings.

Both are Intel XMP certified with profiles that are optimised for Intel’s latest chipsets – just select the hand-tuned profile in your BIOS and you’re ready to strike fear in the hearts of your foes. Available in single module capacities of 8GB – 32GB and kits of 2, 4, and 8 with capacities up to 256GB. Kingston FURY Beast DDR4 RGB and Kingston FURY Beast DDR4 provide powerful performance boost for gaming, video editing, and rendering with speeds up to 3733MHz and CL15–19 latencies.

Those looking for a cost-efficient upgrade will have the option of the smooth and stunning lighting effects of Kingston FURY Beast DDR4 RGB. Available in single module capacities of 8GB–32GB and kit capacities of 16GB–128GB. Or the stylish low-profile heat spreader design of Kingston FURY Beast DDR4, available in single module capacities of 4GB–32GB, and kit capacities of 8GB–128GB. Both feature Plug n Play automatic overclocking at 2666MHz and are Intel XMP ready and ready for AMD Ryzen DDR3 kits also available.

Fully equip your notebook or small form factor machine with Kingston FURY Impact SODIMM to minimise system lag and open up a world of detail. Intel XMP ready and ready for AMD Ryzen in capacities up to 64GB, Plug N Play Kingston FURY Impact DDR4 auto overclocks to the highest frequency published, up to 3200MHz, to support Intel and AMD’s latest CPU technologies. Install the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS and still run cool, quiet, and efficiently, thanks to Kingston FURY Impact DDR4’s low 1.2 voltage. DDR3 also available at speeds up to 1866MHz.

“We’re happy to continue to provide the same great high-performance memory and customer service that gaming and PC enthusiasts have come to expect from us, now through Kingston FURY,” said Iwona Zalewska, DRAM business manager, Kingston EMEA. “Whether you’re contemplating a simple budget-friendly upgrade or ready to max out your system’s capabilities for the ultimate gaming experience Kingston FURY has the products for you.”

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