News
Prime Computer Launches IoT Mini-PC
Swiss hardware manufacturer Prime Computer, known for its fanless Mini PCs and servers, has introduced a Mini Computer especially for the Internet of Things. IoT hardware must simply work without complicated installation or extensive maintenance, writes Prime Computer on the PrimeMini IoT product page. Prime Computer’s latest Mini PC was developed in line with this philosophy. “We deliver the PrimeMini IoT in an optimized standard configuration. This allows us to achieve maximum compatibility and makes installation a snap,” says Prime Computer CEO Sacha Ghiglione. Like all PrimeMinis, the PrimeMini IoT is extremely reliable and low maintenance thanks to its fanless design, high-quality components and the avoidance of moving parts.
The PrimeMini IoT is equipped with a proven Intel Celeron N3350 processor, 4 GB RAM and 64 GB onboard MMC memory. The LAN port and integrated Intel Dual-Band Wi-Fi allow perfect integration into networks. Four USB ports, two HDMI ports and Bluetooth provide additional connectivity. With dimensions of only 17.7 x 3.4 x 11.4 cm, the PrimeMini IoT is extremely compact for a passively cooled computer. This creates completely new possibilities of how and where the PrimeMini IoT can be placed. Especially in combination with the space-saving Vesa mount developed by Prime Computer for the PrimeMini IoT.
The PrimeMini IoT has been optimized in terms of performance, consumption and complexity specifically for use as a gateway or edge computer for IoT. Thanks to its proven Prime Computer reliability, it is ideal for demanding tasks, such as in an exposed monitoring station or dusty production facilities. The PrimeMini IoT is the first Prime Computer product that can only be ordered directly from the manufacturer by select partners.
Gadgets
Drop Announces New Drop + Grell OAE1 Headphones
Drop, CORSAIR’s community-driven e-commerce brand, today announced its latest Grell headphone collaboration, with the latest edition of the Drop + Grell OAE1. Building on the momentum of the signature headphones that launched earlier this year, selling all 1,000 units in a short period, this new edition offers the same world-class engineering and immersive sound profile at a more accessible price.
Based on community feedback, Drop made key adjustments to the new OAE1 headphones to improve the listening and user experience. The OAE1s feature a lighter clamping force and single-sided 6.3mm cable with an insert indicator for added ease of use, as well as a new all-black colourway with dark grey accents. The headphones, rooted in Axel Grell’s three decades of audio engineering and audio product development, feature a driver-forward, open-around-ear structure to map to the human ear and achieve a more natural and realistic sound field.
By moving the drivers in front of and away from the ears, the new OAE1 headphones enable the sound field from the transducers to take advantage of the ear’s natural structure to direct sound into the ear canal. The open-around-ear design minimizes acoustic reflections and controls sound pressure, with the culmination of both innovations resulting in improved stereo imaging, a natural sound field, and the uncovering of the deepest dimensions of any song.
“Building on the success of the signature headphones that sold out earlier this year, the new OAE1s bring the same level of audio innovation and sound precision to a broader audience,” said Grell. “With the Drop + Grell OAE1 headphones, we’ve maintained our commitment to precision engineering and high-fidelity sound while offering a more accessible price point. It’s all about making premium audio experiences accessible to more listeners without compromising on quality.”
The Drop + Grell OAE1 Headphones are available today for $249, $100 less than the previous signature headphones.
News
Samsung Sets New Benchmark in TV Security With FIPS 140-3 Certification
Samsung Electronics has announced that its proprietary cryptography module, Samsung CryptoCore, has earned the prestigious FIPS 140-3 certification from the National Institute of Standards and Technology (NIST). This certification underscores Samsung’s commitment to providing industry-leading security and data protection for Smart TV users.
“As home entertainment systems become more connected, it becomes critical for technology companies to safeguard the personal data that enables the seamless connectivity enjoyed by so many,” said Yongjae Kim, Executive Vice President and Head of the R&D Team, Visual Display Business at Samsung Electronics. “By integrating the FIPS 140-3-certified CryptoCore into our Smart TVs, Samsung is taking our commitment to secure home entertainment a step further and ensuring that our users can freely experience the value of our products.”
Beginning in 2025, Samsung CryptoCore will be fully integrated into Tizen OS, Samsung’s Smart TV operating system, enhancing the security of key products such as TVs, monitors and digital signage. With Samsung CryptoCore embedded in Tizen OS, personal data linked to Samsung accounts will be securely encrypted, SmartThings authentication information will be protected from external hacking threats and content viewed on TVs will benefit from enhanced copyright protection.
Since 2015, Samsung has equipped its Smart TVs with Samsung Knox, a security platform that has earned Common Criteria (CC) certification for 10 consecutive years. But with its newly acquired FIPS 140-3 certification, Samsung has strengthened its defences against hacking and data breaches even further, proactively protecting personal information with advanced encryption technology.
Recognised by governments in 10 countries, the FIPS 140-3 certification requires comprehensive testing of cryptographic modules to ensure their security, integrity, and reliability. For users, this means Samsung Smart TVs offer cutting-edge protection against privacy breaches, allowing them to enjoy their content, connect smart devices, and engage with IoT services securely and without concerns.
News
AMD Intros Versal Premium Series Gen 2 Adaptive SoCs
AMD has announced the AMD Versal Premium Series Gen 2, an adaptive SoC platform designed to deliver the highest levels of system acceleration for a wide range of workloads. Versal Premium Series Gen 2 will be the FPGA industry’s first devices featuring Compute Express Link (CXL) 3.1 and PCIe Gen6 as well as LPDDR5X memory support in hard IP. These next-generation interface and memory technologies access and move data rapidly and efficiently between processors and accelerators.
CXL 3.1 and LPDDR5X help unlock more memory resources faster to address the growing real-time processing and storage demands of data-intensive applications in the data centres, communications, test and measurement, and aerospace and defence markets. “System architects are constantly looking to pack more data into smaller spaces and move data more efficiently between parts of the system,” said Salil Raje, senior vice president and general manager, Adaptive and Embedded Computing Group, AMD. “Our latest addition to the Versal Gen 2 portfolio helps customers improve overall system throughput and utilization of memory resources to achieve the highest performance and unlock insights for their most demanding applications from the cloud to the edge.”
AMD champions open innovation through its support of CXL, an open industry-standard interconnect between processors and devices such as FPGA-based accelerators. With support for CXL 3.1 and PCIe Gen6, the industry’s fastest host interfaces, Versal Premium Gen 2 devices enable industry-leading, high-bandwidth host CPU-to-accelerator connectivity. PCIe Gen6 offers a 2-4X faster line rate compared to competing FPGAs with PCIe Gen4 or Gen5 support, while CXL 3.1 running PCIe Gen6 provides double the bandwidth of competing devices with CXL 2.1 at similar latencies, as well as enhanced fabric and coherency capabilities.
Additionally, by pairing Versal Premium Series Gen 2 with an AMD EPYC CPU, system architects can leverage the latest AMD FPGA-based device connected via CXL or PCIe to a high-performance CPU, to accelerate data-intensive applications and meet rapid data growth demands. CXL also brings an additional benefit of memory coherency to help enable true heterogeneous, accelerated computing.
AMD Versal Premium Series Gen 2 adaptive SoCs accelerate memory bandwidth for faster data transfers and real-time responsiveness with the fastest LPDDR5X memory connectivity available, at up to 8533 Mb/s. This ultra-fast, enhanced DDR memory enables up to 2.7X faster host connectivity over comparable competitive devices with LPDDR4/5 memory. Connectivity to CXL memory expansion modules enables up to 2.7X more total bandwidth than LPDDR5X memory alone.
As a result, the Versal Premium Series Gen 2 allows for scalable memory pooling and extension for multiple accelerators, optimizing memory utilization and increasing bandwidth and capacity. By dynamically allocating a memory pool for multiple devices, Versal Premium Series Gen 2 adaptive SoCs are designed to improve memory utilization in a Multi-Headed Single Logic Device (MH-SLD), allowing it to operate without a fabric or switch, while supporting up to two CXL hosts.
Enhanced security features help the Versal Premium Series Gen 2 transfer data quickly and securely, both in transit and at rest. It is the industry’s first FPGA device to feature support for integrated PCIe Integrity and Data Encryption (IDE) in hard IP. Inline encryption built into hard DDR memory controllers helps secure data at rest, while 400G High-Speed Crypto Engines help the device secure user data at up to 2X faster line rates, enabling faster secure data transactions.
AMD Versal Premium Series Gen 2 development tools are expected to be available in Q2 2025, followed by the availability of silicon samples by early 2026. Production shipments are expected to begin in the second half of 2026.
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